6th World Conference on
Advanced Materials, Nanoscience and Nanotechnology
October 21 - 22 , 2024 | Amsterdam, Netherlands
Virtual Conference
About WCAMNN-Amsterdam-2024
Welcome to the 6th World Conference on Advanced Materials, Nanoscience, and Nanotechnology! a premier gathering of leading experts, researchers, and innovators in the field. Join us in the dynamic city of Amsterdam, Netherlands, on October 21-22, 2024, for a two-day exploration of cutting-edge advancements and breakthroughs in materials science, nanoscience, and nanotechnology.
This conference serves as a global platform for interdisciplinary collaboration, bringing together professionals from academia, industry, and research institutions. Participants can expect an engaging program featuring keynote presentations, expert panel discussions, and research presentations, providing a comprehensive overview of the latest developments in these dynamic fields.
Amsterdam, renowned for its vibrant culture and innovative spirit, provides an inspiring backdrop for this conference. Attendees will have the opportunity to delve into the forefront of materials science, nanoscience, and nanotechnology, fostering knowledge exchange, networking, and collaborative opportunities. Save the dates, October 21-22, 2024, and be part of this transformative event shaping the future of advanced materials and nanotechnology. We look forward to welcoming you to the 6th World Conference in Amsterdam!
Our Distinguished Keynote Speakers
Publication Opportunity
Unlock Your Research's Potential
At our conference, we're not just about presentations; we're about making your research shine. Here's what you gain:
- Digital Object Identifier (DOI): Every accepted and registered abstract is assigned a unique Digital Object Identifier (DOI) by Crossref, ensuring the longevity, accessibility, and recognition of your research abstract. Our Crossref DOI Prefix is 10.62422, which precedes the unique identifier assigned to each abstract.
- Abstract Proceedings: Your research deserves recognition. That's why we publish the abstracts of all accepted and registered submissions in our esteemed Conference Abstract Proceedings. This prestigious publication ensures your work is not just seen but formally recognized and cited.
- ISBN Number: Recognizing the value of your research, we have assigned a dedicated ISBN number to our Conference Abstract Proceedings. This year features : ISBN Online: 978-81-970328-2-0 for digital format. This ISBN ensures your work is recognized and accessible for citation in digital academic realms.
Participating in our conference goes beyond presentation; it's about elevating your research to the next level. With DOI and ISBN Numbers, your work gains the recognition it deserves. We eagerly anticipate the opportunity to showcase your invaluable contributions.
Who Can Attend?
- Materials scientists and engineers
- Nanotechnologists and researchers
- Chemists and physicists rts
- Biomedical engineers and researchers
- Materials chemistry experts
- Materials characterization specialists
- Biomaterials professionals
- Metallurgists and metallurgical engineers
- Energy materials researchers and engineers
- Composite materials scientists and engineers
- Nanomaterials experts
- Electronic materials engineers and researchers
- Polymer scientists and engineers
- Ceramics researchers and engineers
- Surface science and thin film experts
- Materials simulation and modeling specialists
- Recycling and sustainability professionals
- Materials testing and analysis experts
- Nanoelectronics and photonics specialists
- Advanced manufacturing professionals
Why to Attend?
- Learn from experts in your field
- Expand your professional network
- Gain new perspectives and insights
- Present your own research and receive feedback
- Discover new career paths and job opportunities
- Expose yourself to new ideas and innovations
- Explore new cultures and countries
- Take a break from your routine and recharge
- Receive a certificate of participation
Conference Schedule
Our tentative program is scheduled as follows.